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Table of Contents for the Digital Edition of PCB-Jun2012
Cover
June Featured Content
Contents
Column — Chasing Our Tails
Short — Implantable, Wireless Sensors Share Secrets of Healing Tissues
Feature — Solderless Aluminum Rigid-Flex Circuit Assembly: An Alternative Approach
Video Interview — 1-mil Lines and Spaces: Fact or Fiction?
Feature — Fine-Line Imaging for 2.5-D Circuit Traces
Column — Design Rules & DFM for High-Speed Design
Feature — Metal in the Board—A Return to the Future
Feature — Optical Layer-to-Layer Alignment
Column — Copper Surface Preparation for Dry Film Lamination, Part B
Feature — Z-axis Interconnection in Organic Packaging
Short — Engineers Use Plasmonics to Create Invisible Photodetector
Feature — PCB: An Important Piece of the Puzzle in LED Thermal Management
Video Interview — Endicott Interconnect's Plans for HDI
Feature Column — Circuit Materials Enabling Future PCB Technologies: A Review of Rogers' Innovations in Laminate Technology
Video Interview — Rogers: New Thermal Product Developments
News — PCB Design007 Highlights
Column — Is it Black Pad or Something Else? Case Study No. 2
Article — What's Driving the State of the Art in Flying-Probe Bare-Board Testing?
News — Mil/Aero007 Highlights
Column — The Reliability Mindset!
Article — An Innovative Solution to Traditional Soldermask Process Challenges
News — Flex007 Highlights
Article — Epec Engineered Technologies...60 Years & Counting
Short — Observing Oriented Attachment in Nanocrystal Growth
Column — The Strategic Value of ISO
News — Supplier/New Product Highlights
News — Top Ten Most-Read News Highlights from PCB007 this Month
Column — China: From the Inside
Events Calendar
Advertiser Index and Masthead
PCB-Jun2012
Electronics
NEW PCBs
JUNE 2012
THE WAY I SEE IT
CHASING OUR TAILS continues
CHASING OUR TAILS continues
CHASING OUR TAILS continues
Solderless Aluminum Rigid-Flex Circuit Assembly:
of aluminum and which completely bypasses
SOLDERLESS ALUMINUM RIGID-FLEX CIRCUIT ASSEMBLY continues
SOLDERLESS ALUMINUM RIGID-FLEX CIRCUIT ASSEMBLY continues
SOLDERLESS ALUMINUM RIGID-FLEX CIRCUIT ASSEMBLY continues
SOLDERLESS ALUMINUM RIGID-FLEX CIRCUIT ASSEMBLY continues
SOLDERLESS ALUMINUM RIGID-FLEX CIRCUIT ASSEMBLY continues
Fine-Line
The technology is predicated on the use
FINE LINE IMAGING FOR 2.5-D CIRCUIT TRACES continues
PRECISON ECONOMICAL
BEYOND DESIGN
DESIGN RULES & DFM FOR HIGH-SPEED DESIGN continues
DESIGN RULES & DFM FOR HIGH-SPEED DESIGN continues
DESIGN RULES & DFM FOR HIGH-SPEED DESIGN continues
Metal in the Board—
the world—opportunities such as motor con-
METAL IN THE BOARD—A RETURN TO THE FUTURE continues
METAL IN THE BOARD—A RETURN TO THE FUTURE continues
METAL IN THE BOARD—A RETURN TO THE FUTURE continues
METAL IN THE BOARD—A RETURN TO THE FUTURE continues
OPTICAL
Figure A: Tolerances associated with pinning systems.
OPTICAL LAYER-TO-LAYER ALIGNMENT continues
The UK’s leading PCB equipment supplier
OPTICAL LAYER-TO-LAYER ALIGNMENT continues
OPTICAL LAYER-TO-LAYER ALIGNMENT continues
OPTICAL LAYER-TO-LAYER ALIGNMENT continues
OPTICAL LAYER-TO-LAYER ALIGNMENT continues
KARL’S TECH TALK
COPPER SURFACE PREPARATION FOR DRY FILM LAMINATION, PART B continues
COPPER SURFACE PREPARATION FOR DRY FILM LAMINATION, PART B continues
Z-axis Interconnection
Figure 2: Ability to terminate vias at any internal layer (right) provides additional channels for wiring
Z-AXIS INTERCONNECTION IN ORGANIC PACKAGING continues
Z-AXIS INTERCONNECTION IN ORGANIC PACKAGING continues
Z-AXIS INTERCONNECTION IN ORGANIC PACKAGING continues
PCB:An Important
nons: Thermal conduction, thermal convection
PCB: AN IMPORTANT PIECE OF THE PUZZLE IN LED THERMAL MANAGEMENT continues
PCB: AN IMPORTANT PIECE OF THE PUZZLE IN LED THERMAL MANAGEMENT continues
PCB: AN IMPORTANT PIECE OF THE PUZZLE IN LED THERMAL MANAGEMENT continues
LIGHTNING SPEED LAMINATES
CIRCUIT MATERIALS ENABLING FUTURE PCB TECHNOLOGIES continues
Most-Read PCBDesign007
TROUBLE IN YOUR TANK
Your Single Source
IS IT BLACK PAD OR SOMETHING ELSE? CASE STUDY NO. 2 continues
IS IT BLACK PAD OR SOMETHING ELSE? CASE STUDY NO. 2 continues
What’s Driving the
edge of grid testing through our Luther & Mael-
FLYING-PROBE BARE-BOARD TESTING continues
Final Finish
FLYING-PROBE BARE-BOARD TESTING continues
FLYING-PROBE BARE-BOARD TESTING continues
Most-Read Mil/Aero007
SOLVING YOUR DAM PROBLEMS
Why choose Fein-Line?
THE RELIABILITY MINDSET! continues
THE RELIABILITY MINDSET! continues
An Innovative Solution
Figure 3: Panel dimensional variations.
SOLDERMASK PROCESS CHALLENGES continues
SOLDERMASK PROCESS CHALLENGES continues
Most-Read Flex007 News
Epec
website for a while. How were Epec PCBs in-
EPEC ENGINEERED TECHNOLOGIES...60 YEARS & COUNTING continues
EPEC ENGINEERED TECHNOLOGIES...60 YEARS & COUNTING continues
EPEC ENGINEERED TECHNOLOGIES...60 YEARS & COUNTING continues
POINT OF VIEW
THE STRATEGIC VALUE OF ISO continues
Most-Read Supplier/New Product
TOP
e IPC Releases PCB Industry
THE SALES CYCLE
CHINA: FROM THE INSIDE continues
CHINA: FROM THE INSIDE continues
CHINA: FROM THE INSIDE continues
CHINA: FROM THE INSIDE continues
EVENTS
PUBLISHER: BARRY MATTIES