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Table of Contents for the Digital Edition of PCB-May2011
Cover
Introduction
Contents
Column - The Phoenix Rises
Short – Sunstone Circuits Releases New CAD Conversion Service
Feature - 3D Interconnection Technologies for Electronic Products: A Perspective View of Electronic Interconnection Technologies from Chip to System
Video Interview - IPC's DoD Roadmapping Efforts
Column - Recessed Embedded Circuits
Video Interview - New Low-Dk, High-Speed Flex Material
Feature - How MEMS are Re-inventing Electronics and Opening New Markets
Column - Correlation, Communication, Calibration
Video Interview - Ohmega Focuses on "Absolute Reliability"
Article - PCB Cost Reductions
Column - IPC APEX EXPO Reflections
Short - Removing Moisture is Still a Hot Topic
Article - PCB Design Tecgniques for DDR, DDR2 & DDR3 (Part 1)
Column - How to Implement Lean Manufacturing into a Printed Circuit Board Shop
Short - AT&T Earns Quality Award
Short - TTM to Acquire Remaining Stake in Aspocomp
Article - Why It's Important to Understand Total Cost of Ownership for Outsourcing Manufacturing
Top Ten Most-Read News Highlights from PCB007 this Month
Events Calendar
Column - A Time for Change
Next Month in The PCB Magazine
Ad Index & Masthead
PCB-May2011
10
Semiconductor
W E H A V E L I F T OFF
MAY 2011
May 2011 • The PCB Magazine 5
SUMMARY
SOMETIMES A PHONE CALL
THE PHOENIX RISES continues
THE PHOENIX RISES continues
3D Interconnection Technologies
THE ELECTRONICS MANUFACTURING INDUSTRY’S ATTENTION OVER THE
3D INTERCONNECTION TECHNOLOGIES FOR ELECTRONIC PRODUCTS continues
May 2011 • The PCB Magazine 13
3D INTERCONNECTION TECHNOLOGIES FOR ELECTRONIC PRODUCTS continues
Global leaders in testing.
3D INTERCONNECTION TECHNOLOGIES FOR ELECTRONIC PRODUCTS continues
May 2011 • The PCB Magazine 17
3D INTERCONNECTION TECHNOLOGIES FOR ELECTRONIC PRODUCTS continues
3D INTERCONNECTION TECHNOLOGIES FOR ELECTRONIC PRODUCTS continues
3D INTERCONNECTION TECHNOLOGIES FOR ELECTRONIC PRODUCTS continues
SUMMARY
May 2011 • The PCB Magazine 23
RECESSED EMBEDDED CIRCUITS continues
INNOVATIVE ENGINEERING DESIGN INCORPORATED INTO EVERY PRESS SYSTEM
RECESSED EMBEDDED CIRCUITS continues
RECESSED EMBEDDED CIRCUITS continues
How MEMS are Re-inventing
“
HOW MEMS ARE RE-INVENTING ELECTRONICS AND OPENING NEW MARKETS continues
CONFERENCE ON FLEXIBLE CIRCUITS
HOW MEMS ARE RE-INVENTING ELECTRONICS AND OPENING NEW MARKETS continues
Christopher Associates has your circuit boards covered
SUMMARY
CORRELATION, COMMUNICATION, CALIBRATION continues
CORRELATION, COMMUNICATION, CALIBRATION continues
PCB COST REDUCTIONS
“
PCB COST REDUCTIONS continues
May 2011 • The PCB Magazine 41
PCB COST REDUCTIONS continues
PCB COST REDUCTIONS continues
SUMMARY
days of the industry at Technograph in the
IPC APEX EXPO REFLECTIONS continues
IPC APEX EXPO REFLECTIONS continues
IPC APEX EXPO 2011 — SHOW SHOTS
IPC APEX EXPO 2011 — SHOW SHOTS
Removing Moisture
Why choose Fein-Line?
PCB Design Techniques
“
PCB Design Techniques for DDR, DDR2 & DDR3 (Part 1) continues
May 2011 • The PCB Magazine 55
SUMMARY
Flexible Circuit Technology
HOW TO IMPLEMENT LEAN MANUFACTURING INTO A PCB SHOP continues
HOW TO IMPLEMENT LEAN MANUFACTURING INTO A PCB SHOP continues
Why It’s Important to Understand Total Cost
“
TOTAL COST OF OWNERSHIP FOR OUTSOURCING MANUFACTURING continues
May 2011 • The PCB Magazine 63
TOP
e Conversations with...
EVENTS
American Competitiveness
SUMMARY
May 2011 • The PCB Magazine 69
A TIME FOR CHANGE continues
PUBLISHER: BARRY MATTIES