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Table of Contents for the Digital Edition of SMT-July2012
Cover
July Featured Content — Advanced Packaging
Contents
Column — Let Them Eat Cake
Column — 100 Points on Lead-Free Performance and Reliability, Part 2
Feature — The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish
Feature — Is Cleaning Critical to PoP Assemblies?
Video Interview — Latest Developments in Aqueous Flux Removal
Short — First Chemical Circuit Developed
Column — It's Getting Crowded
Feature — MEMS/SMT Hybrid PCBs Take Design/Assembly Detour
Feature — Assembly and Rework of Lead-Free PoP Technology
Video Interview — New Products and Services from Assembleon
Article — Large Diameter Wedge Boding of Round and Ribbon Wire: The Future for High-Power, High-Reliability Automotive Electronics
Column — In Praise of an Accurate Fab Drawing
News — Supplier/New Product Highlights
Column — Microsemi Denies Security Issue
News — Mil/Aero007 Highlights
News — Top Ten Most-Read News Highlights from SMTonline this Month
Column — The Critical 20
Events Calendar
Advertisers Index and Masthead
SMT-July2012
ENGINEERING SOLUTIONS FOR PCB MANUFACTURING
ADVANCED PACKAGING
JULY 2012
THEWAY I SEE IT
October 2011 • SMT Magazine 7
The way i See iT
The way i See iT
COLUMN
SMT perSpecTiveS and proSpecTS
SMT perSpecTiveS and proSpecTS
The Morphology
Another issue with these leadless packages
THE MORPHOLOGY EVOLUTION AND VOIDING OF SOLDER JOINTS continues
THE MORPHOLOGY EVOLUTION AND VOIDING OF SOLDER JOINTS continues
THE MORPHOLOGY EVOLUTION AND VOIDING OF SOLDER JOINTS continues
THE MORPHOLOGY EVOLUTION AND VOIDING OF SOLDER JOINTS continues
THE MORPHOLOGY EVOLUTION AND VOIDING OF SOLDER JOINTS continues
Trainwith theMasters.
THE MORPHOLOGY EVOLUTION AND VOIDING OF SOLDER JOINTS continues
THE MORPHOLOGY EVOLUTION AND VOIDING OF SOLDER JOINTS continues
THE MORPHOLOGY EVOLUTION AND VOIDING OF SOLDER JOINTS continues
THE MORPHOLOGY EVOLUTION AND VOIDING OF SOLDER JOINTS continues
Is Cleaning Critical
result in properly cleaned assemblies. The au-
IS CLEANING CRITICAL TO POP ASSEMBLIES? continues
IS CLEANING CRITICAL TO POP ASSEMBLIES? continues
IS CLEANING CRITICAL TO POP ASSEMBLIES? continues
IS CLEANING CRITICAL TO POP ASSEMBLIES? continues
IS CLEANING CRITICAL TO POP ASSEMBLIES? continues
PRECISON ECONOMICAL
IS CLEANING CRITICAL TO POP ASSEMBLIES? continues
Video Interview
SMT TRENDS & TECHNOLOGIES
SMT TrendS & TechnologieS
SMT TrendS & TechnologieS
MEMS/SMT Hybrid PCBs
functions (Figure 1). The normal size of a three-
MEMS/SMT HYBRID PCBS TAKE DESIGN/ASSEMBLY DETOUR continues
MEMS/SMT HYBRID PCBS TAKE DESIGN/ASSEMBLY DETOUR continues
MEMS/SMT HYBRID PCBS TAKE DESIGN/ASSEMBLY DETOUR continues
MEMS/SMT HYBRID PCBS TAKE DESIGN/ASSEMBLY DETOUR continues
MEMS/SMT HYBRID PCBS TAKE DESIGN/ASSEMBLY DETOUR continues
Assembly and
Figure 2: Peripherally leaded packages consume
ASSEMBLY AND REWORK OF LEAD-FREE POP TECHNOLOGY continues
ASSEMBLY AND REWORK OF LEAD-FREE POP TECHNOLOGY continues
ASSEMBLY AND REWORK OF LEAD-FREE POP TECHNOLOGY continues
ASSEMBLY AND REWORK OF LEAD-FREE POP TECHNOLOGY continues
ASSEMBLY AND REWORK OF LEAD-FREE POP TECHNOLOGY continues
ASSEMBLY AND REWORK OF LEAD-FREE POP TECHNOLOGY continues
ASSEMBLY AND REWORK OF LEAD-FREE POP TECHNOLOGY continues
ASSEMBLY AND REWORK OF LEAD-FREE POP TECHNOLOGY continues
Large Diameter Wedge Bonding
modules are expensive, field failures carry huge
LARGE DIAMETER WEDGE BONDING OF ROUND AND RIBBON WIRE continues
LARGE DIAMETER WEDGE BONDING OF ROUND AND RIBBON WIRE continues
ZULKI’S PCB NUGGETS
ZulKi’S pcB nuggeTS
ZulKi’S pcB nuggeTS
Top Ten Most-Read Supplier/
THE SUPPLY SIDE
The Supply Side
Top Ten Most-Read
TOP
eHenkel to Acquire Cytec
THE SALES CYCLE
The SaleS cycle
October 2011 • SMT Magazine 29
e v enT S
puBliSher: BARRY MATTIES